Advanced Rigid Substrates

DYCONEX features an advanced rigid multilayer material allowing ultra-thin build-ups for various high-frequency applications particularly suitable for HF chip packaging.

The material offers low dielectric properties (low Dk and low Df) combined with a low thermal expansion coefficient (CTE) and high dielectric strength.

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LTCC Substrates

LTCC (Low-Temperature Co-fired Ceramic) is a multilayer capable substrate technology offering excellent RF and microwave...