Master Bond's Thermally Conductive, Low-Viscosity Epoxy Features Cryogenic Serviceability - Verdict Medical Devices
Join Our Newsletter - Get important industry news and analysis sent to your inbox – sign up to our e-Newsletter here

Master Bond’s Thermally Conductive, Low-Viscosity Epoxy Features Cryogenic Serviceability

Master Bond EP30FLAO is a two-component epoxy resin system for high-performance potting, bonding, sealing and coating. It is extremely versatile and can be used in a wide variety of cryogenic applications. This low-viscosity epoxy with excellent flow characteristics makes it ideal as a thermally conductive potting compound. It is widely used in the electronic, electrical, computer, metalworking, appliance and chemical industries where electrical insulation, environmental protection and heat transfer is required.

EP30FLAO features a wide service temperature range of 4K to 250°F. Its thermal conductivity is 9-10 BTU/in/ft²/hr/°F. The viscosity of the mixed compound is 5,000 cps to 6,000 cps at 75°F. In addition to these attractive attributes, it has a low thermal expansion coefficient, superior dimensional stability, good physical strength and toughness.

Parts A and B are available in half pint, pint, quart, one gallon and five gallon containers.

Master Bond’s cryogenically serviceable epoxies

Master Bond’s EP30FLAO is a versatile, two-component epoxy system for demanding thermal management applications at cryogenic temperatures. Read more about Master Bond’s cryogenic epoxy formulations at the company’s website, or contact Master Bond’s technical support team.

More About This Company