Ultra-Fast Curing, Thermally Stable Epoxy Meets Nasa Low Outgassing Specifications

Master Bond’s EP65HT-1 combines high-temperature resistance and fast room temperature curing in a Nasa low outgassing approved epoxy. It also offers superior electrical insulation capabilities and strong chemical resistance.

With an extremely high glass transition temperature exceeding 125°C, the EP65HT-1 features fast cure times, even when mixed in small masses. For example, a 10g-20g mass will cure in 3-5 minutes at room temperature. It is serviceable over the wide temperature range of -60°F to +400°F, has a tensile shear strength approaching 3,000psi, and a shore D hardness greater than 75.

The EP65HT-1 bonds well to a wide range of substrates including metals, glass, ceramics, rubbers, and many plastics, and is widely used in the electrical, electronic, computer, medical, optical, transportation, aerospace, and OEM industries. The adhesive is dark brown in color and is available in a convenient dispensing gun that mixes the parts with a ten to one ratio. It is also available for use in half pint, pint, quart, gallon, and five gallon container kits.

Master Bond’s EP65HT-1 is a high-temperature resistant, fast-curing, room temperature epoxy that meets Nasa low outgassing standards.

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