Butterfly Network. has been granted a patent for an ultrasonic transducer device featuring a patterned film stack with a metal electrode and bottom cavity layer, a planarized insulation layer, and a membrane support layer. The design includes a cavity and a CMP stop layer, enhancing its functionality. GlobalData’s report on Butterfly Network gives a 360-degree view of the company including its patenting strategy. Buy the report here.

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According to GlobalData’s company profile on Butterfly Network, Doppler ultrasound imaging was a key innovation area identified from patents. Butterfly Network's grant share as of July 2024 was 44%. Grant share is based on the ratio of number of grants to total number of patents.

Ultrasonic transducer device with patterned film stack

Source: United States Patent and Trademark Office (USPTO). Credit: Butterfly Network Inc

The patent US12070773B2 describes an ultrasonic transducer device characterized by a complex layered structure designed to enhance its performance. The device includes a patterned film stack on a substrate, which consists of a metal electrode layer and a bottom cavity layer. A planarized insulation layer is positioned on different regions of the substrate, while a cavity is formed in a membrane support layer that includes a chemical mechanical polishing (CMP) stop layer. This CMP stop layer, which can be made of dielectric materials such as silicon nitride (SiN), underlies parts of the membrane support layer but not the cavity itself. The metal electrode layer is specified to be titanium (Ti) with a thickness ranging from 100 nm to 300 nm, and the insulation layer is made of silicon dioxide (SiO2).

Further claims detail the composition and thickness of various layers within the transducer device. The bottom cavity layer is formed using a combination of chemical vapor deposition (CVD) SiO2 and atomic layer deposition (ALD) Al2O3, with specified thicknesses for each layer. The membrane support layer is also made of SiO2 and has a thickness between 100 nm and 300 nm, while the membrane itself is composed of doped silicon and has a thickness ranging from 2 microns to 10 microns. The design of the transducer allows for a tailored cavity depth by adjusting the combined thickness of the CMP stop layer and the membrane support layer, thereby optimizing the device for specific ultrasonic applications.

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GlobalData Patent Analytics tracks bibliographic data, legal events data, point in time patent ownerships, and backward and forward citations from global patenting offices. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.