Microelectronics devices composed of integrated circuits are complex and pose many engineering challenges. A careful design must be employed to allow heat to be dissipated from the device and mitigate thermally induced stresses.
Adhesive encapsulants have been developed to seal and protect the sensitive electrical components and connections from contaminants and assist with thermal management. Encapsulants provide mechanical support, distribute stresses, and protect sensitive connections from mechanical shock.
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