Aehr Test Systems unveil FOX-XP System and Burn-in System

12 July 2016 (Last Updated July 12th, 2016 18:30)

US-based medical device company Aehr Test Systems has unveiled its FOX-XP System, the latest multi-wafer test and burn-in system for high-volume production and early failure rate (EFR) test.

US-based medical device company Aehr Test Systems has unveiled its FOX-XP System, the latest multi-wafer test and burn-in system for high-volume production and early failure rate (EFR) test.

The Universal Channel architecture allows any channel to enact functionalities such as I/O, device power supply (DPS) or per-pin precision measurement unit (PPMU).

It also allows customers to conduct per pin parametric testing, more extensive digital pattern test with deeper data stimulus / capture memory (32M per pin), and a deeper scan (768M) optimised for BIST/DFT testing.

The system can be configured with up to 18 slots of wafer test resources enabling up to 18 wafers to be tested simultaneously hence rendering the device cost-efficient.

Aehr Test Systems president and CEO Gayn Erickson said: “Our new FOX-XP system is very well positioned to address the new challenges by lowering the cost of test using DFT methodologies, and we believe the FOX-XP system will significantly expand our served available market in calendar 2016 and beyond.”

It operates on Aehr’s patented WaferPak full wafer contactor, which addresses the requirement of very high pin count and small pad size and pad pitch for the conventional devices.

"The system can be configured with up to 18 slots of wafer test resources enabling up to 18 wafers to be tested simultaneously hence rendering the device cost-efficient."

The device is also fitted with Aehr’s thermal chucks which manage the temperature of the high-power density of the devices on the wafer.

The footprint of the 18 wafer test system is similar to the footprint of typical semiconductor Automatic Test Equipment (ATE) that can only test one wafer at a time.

The FOX-XP system is based on the company’s next-generation multi-wafer test solution which facilitates functional test and burn-in/cycling of flash memories, microcontrollers, sensors, optical devices, laser diodes, VCSELs, LEDs and other leading-edge ICs in wafer form.

The system also uses the company's FOX WaferPak contactor, which offers a cost effective solution for making full wafer electrical die contact in a multi-wafer environment.


Image: The WaferPak Aligner.  Photo: courtesy of Aehr Test Systems.