Amedica has launched its new Valeo II anterior lumbar (AL) interbody fusion device, designed for use with autograft to facilitate intervertebral body fusion of the spine in skeletally mature patients.
The Valeo II AL interbody fusion device is made of Silicon Nitride biomaterial, which has been shown to achieve superior new bone growth and osteointegration, along with proven anti-infective properties.
It includes a streamlined, comprehensive instrumentation set designed for ease-of-use.
The new design of the fusion device offers enhanced bone-to-implant interface and resistance to push out when compared with competitive offerings.
Amedica president and CEO Eric K Olson said the company is committed to delivering products that address the changing needs of spinal surgeons.
“As Amedica continues to collaborate with surgeons to develop innovative, safe and effective interbody fusion devices, Silicon Nitride is increasingly becoming the gold standard material for spinal fusion devices,” Olson said.
“With the launch of Valeo II AL, Amedica is positioned to rapidly increase our market share in the $1.6bn interbody fusion device market.”
The next-generation Silicon Nitride AL implants are semi-radiolucent, helping surgeons determine exact placement intra-operatively and improve post-operative monitoring.
Valeo interbody fusion devices do not cause MRI or CT artifacts, which can make imaging interpretation difficult.
According to the company, the success of the Valeo interbody fusion device system proves the safety and effectiveness of Silicon Nitride technology.
The Silicon Nitride AL device provides an optimal environment for bone growth, while reducing the risk for infection due to its innate anti-infective properties.
The Valeo II AL’s inherent advantages help improve the efficacy of spinal fusion procedures resulting in enhanced patient care and better patient outcomes.
According to GlobalData estimates, the spinal fusion market in the US was valued at $3.95bn in 2012 and is expected to grow at a CAGR of 1.9% to reach $4.50bn by 2019.