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Advancing Flex PCB Technology

Advancing Flex PCB Technology-feature-image

An ultra-thin, four-layer flex PCB with a 12µm core and a total thickness of just 110µm achieves an impressive minimal bend radius of 220µm, 50% smaller compared to conventional designs!

This cutting-edge technology is gaining traction in industries where miniaturisation is key, such as medical applications.

To enhance reliability in bending zones:

  • Keep traces in the inner layers to prevent cracks and damage
  • Use a special solder mask or, even better, a coverlayer
  • Opt for Direct Immersion Gold (DIG) as it offers superior bending performance by eliminating nickel, unlike ENIG and ENEPIG

The future of flex PCBs is thinner, more flexible, and more durable than ever!

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