The companies Sensry GmbH (Sensry) and Micro Systems Technologies (MST Group) announced today the entering...
DYCONEX has developed a novel approach to miniaturised, hermetic and highly reliable smart sensor modules with diameters down to 6mm. They are ideal for use in medical, food processing, pharmaceutical, chemical or industrial applications.
The tiny modules are based on liquid crystal polymer (LCP), a thermoplastic dielectric material with very low water absorption (<0.04%), high chemical stability and low thermal expansion.
LCP is suitable both as a substrate material and as an encapsulate. The permeability for water and gases is one of the lowest among polymeric materials. Soak tests with an embedded, moisture sensitive test chip have demonstrated long term stability (>14 months) and sufficient hermeticity for exposures in harsh environments.
Processing techniques for LCP substrates are the same as for other substrate materials. Resolution of lines, spaces and vias are comparable, multilayer structures can be built and part of the metal layers can be used to form a coil for near-field communication (NFC). The substrates can be assembled with standard surface mount technology (SMT) processes, as well as connected and sealed without the need for any adhesives by benefiting from its thermoplastic properties.
LCP is a homogenous material and can be easily machined with ultraviolet (UV) lasers with a precision down to the micrometre scale, for example, to integrate cavities and openings for recessed components.
With more than 50 years of experience, DYCONEX is an international leader in the supply of highly complex flexible, rigid-flex and rigid high-density interconnection (HDI) / microvia circuit boards and chip-substrate solutions.
These products are used in applications where miniaturization, increased functionality, quality and the highest level of reliability play a role.
Headquartered in Bassersdorf, DYCONEX has 180 employees and the company is a member of the Micro Systems Technologies Group.
Meet DYCONEX at the following upcoming events:
- Smart Systems Integration, taking place from 10-11 April at Hotel Barceló Sants in Barcelona, Spain. Visit Booth H-17
- SMT connect, taking place 7-9 May in Messezentrum Nuremberg, Germany. Visit Booth 218E, Hall 5
- T4M, taking place 7-9 May in Messe Stuttgart, Germany. Visit Swiss Pavilion Booth 30.6, Hall 9D
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