Micro Systems Technologies Group Components for Medical Devices
The Micro Systems Technologies (MST) Group is specialised in developing and manufacturing miniaturised, integrated electronic module solutions with highest reliability from one source.
Clients of MST Group work in technologically advanced industries that demand exceptional performance and the highest level of reliability.
Its synchronised operations facilities are located in Switzerland, Germany and the US, with more than 1,100 employees. This enables MST to be active worldwide and maintain global business relationships.
The MST Group comprises four companies, each specialising in a different area.
DYCONEX is based in Bassersdorf, Switzerland. It provides high-density interconnect (HDI) / microvia PCBs in flex, rigid-flex and rigid technology, and packaging substrates.
Micro Systems Engineering GmbH has its facilities in Berg, Germany. The company produces complex low-temperature co-fired ceramic (LTCC) substrates and provides advanced assembly and semiconductor packaging processes.
Based in Lake Oswego, Oregon, US, Micro Systems Engineering, Inc develops and manufactures complete electronic modules, and carries out SMD assembly and testing.
LITRONIK Batterietechnologie is based in Pirna, Germany. It manufactures high-performance batteries (based on lithium-iodine and lithium manganese dioxide) for active medtech implants.
Components and modules for active implants requiring high-reliability
The development and manufacture of components and modules for life-sustaining medical devices and other critical applications typify the quality awareness and the management systems of all MST companies.
The effectiveness of these quality systems is confirmed by official certification of the MST companies to ISO:9001, ISO:13485, as well as other sector-specific standards.
Integrated solutions for medical applications
Starting with the specifications phase, through design prototypes up to volume production, the MST Group is a reliable partner for turning any idea into a marketable product.
MST’s offering includes:
- Electronic modules: design, substrate manufacturing, semiconductor packaging, board assembly, assembly of additional parts, test services
- Batteries and battery packs: customer-specific developments, standard products for initial laboratory tests or small manufacturing runs
If you would like more information or require a specific solution, please get in touch.
Products and Services
LTCC (Low-Temperature Co-fired Ceramic) is a multilayer capable substrate technology offering excellent RF and microwave performance characteristics. Its low sintering temperature (approximately 900°C) allows co-firing with highly conductive metals such as silver and gold.
Advanced Rigid Substrates
DYCONEX features an advanced rigid multilayer material allowing ultra-thin build-ups for various high frequency
applications particularly suitable for HF chip packaging.
Flexible Substrates for Smart Sensor Applications
The requirements for smart sensors include miniaturised units that are highly reliable and integrated, cost-effective, hermetic and biocompatible for medical applications.
Ultra-thin Base Materials Take PCB Miniaturisation to the Next Level
New approaches are needed to meet the increasing demand for smaller and thinner electronic devices.
Micro Systems Technologies (MST) company DYCONEX has successfully tested the production use of self-driving transport robots with a view to automate internal goods flow between departments and cleanroom zones.Read more
MST company DYCONEX has increased productivity in production through targeted use of robot handling systems for loading and unloading laser machines.Read more
DYCONEX AG, an MST company and the world's leading supplier of highly complex circuit board solutions, has made a major investment in the MXY2 drilling and routing machine from Schmoll Maschinen.Read more
Micro Systems Technologies Group (MST) is attending a table top exhibition during the 6th Annual Bay Area Biomedical Device Conference.Read more
Micro Systems Engineering has expanded its existing cleanroom capacity with a state-of-the-art cleanroom, bringing the total cleanroom area to 20,000ft².Read more
Micro Systems Technologies Management AG has moved its sales and marketing offices to a new location.Read more
The Micro Systems Technologies (MST) group, a global provider of innovative components and manufacturing services for the medical device industry has experienced strong market growth in recent years.Read more
DYCONEX announced that it has added Ticer TCR-HF foils to its range of build-up materials. TCR-HF is a low insertion loss NiCr thin film embedded-resistor copper foil, designed especially for high-frequency telecommunications, aerospace and defence applications.Read more
The Sorin Group Cardiac Rhythm Management Business Unit (Sorin CRM) has honoured DYCONEX as the best supplier for printed circuit boards in 2012. The prize was handed over in mid-June 2013 as part of the annual supplier event in Clamart, France.Read more
The newly implemented electronic failure catalog enables DYCONEX and its customers to use the same criteria for visual inspection of PCBs, either during in-process or final inspection at DYCONEX, or during incoming inspection at its customers' facilities.Read more
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