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Interconnect Solutions such as Wrap-Around PCBs for Optimal Thermal Management

By DYCONEX
A concise white paper presenting DYCONEX's wrap-around PCB interconnect solutions—combining flexible multilayer circuits, copper-filled microvias, metal back-sheets/cores (CIC, CMC, Al) and advanced materials (LCP, polyimide)—to separate electrical and mechanical functions and deliver high-density, highly reliable thermal management for aerospace, defense, and RF applications.
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