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Rigid IC Substrates & Ultra HDI Boards

By DYCONEX
Discover high-precision PCB solutions in finest lines/spaces down to 25/35 μm, ultra-thin base materials down to 30 μm with low CTE, and DYCOstrate® build-ups with buried, blind, staggered, and stacked vias. Our high-frequency rigid multilayer circuit boards combine LCP with other glass-reinforced materials. To read more please download this free white paper.
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