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  1. Master Bond
26 April 2011

Low Thermal Expansion Epoxy Passes NASA Low Outgassing Tests

Formulated with a special blend of polymeric and inorganic materials, Master Bond EP30LTE-LO features unparalleled dimensional stability and sets new standards of performance for bonding, sealing, casting and coating applications in the aerospace, electrical, electronic, chemical, optical, and computer industries. This two-component epoxy combines outstanding performance with a very low thermal expansion coefficient, a significant breakthrough from the high thermal expansion that is typical of most epoxy compounds.

Serviceable over the wide temperature range of -60°F to 250°F, EP30LTE-LO cures at room temperature with 85% of its maximum strength developed within 48hr. Faster cures are possible at elevated temperatures. This 100% reactive epoxy features an exceptionally low coefficient of thermal expansion of 12×10-6in/in/°C and a low shrinkage rate of less than 0.0002in/in. It bonds well to metals, glass, ceramics, wood, vulcanized rubbers and most plastics, and produces bonds with a tensile strength over 5,000 psi.

This electrically insulative system resists thermal cycling and chemicals, including water, fuels, and many acids, bases, salts and organic solvents. It has a long working life of up to 60min for a 200g mass.

EP30LTE-LO has a ten to one mix ratio by weight and can be easily applied with a spatula, knife, trowel, brush or paint roller. It can also be readily cast as thick as 1in without undue exotherm developing. EP30LTE-LO is available in half-pint, pint, quart, gallon and 5 gallon container kits.

Master Bond low outgassing epoxy systems

Master Bond’s low outgassing epoxy, EP30LTE-LO, features a low thermal expansion coefficient with solid electrical insulation properties. Read more about low outgassing epoxies at Master Bond’s website.

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