Accumold Geared-up for 2014

Even the polar vortex that drove a knife of Arctic air through the heart of the nation and sent temperatures plummeting far below zero can’t cool the Accumold marketing team’s enthusiasm for the red-hot 2014 trade show schedule.

"We’re starting out this year’s schedule with the DesignCon conference and expo in Santa Clara, California, from 28-30 January," said Accumold marketing director Aaron Johnson. "DesignCon’s focus is ‘Where the Chip Meets the Board’ and we can’t help but be fired up about the opportunities to share in the latest conversations with the best in the industry about taking products to that next performance level."

He continued: "I think the event organizers say it best when they note that DesignCon is ‘created by engineers for engineers.’ DesignCon is the largest gathering of chip, board and systems designers and silicon manufacturers in the world.

"It enables those professionals to grow their design expertise, learn about the latest advanced design technologies and tools from top vendors like Accumold, and network with fellow engineers and design engineering experts."

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