Accumold to Attend SMT Hybrid Packaging Show in Nuremberg, Germany
The SMT Hybrid Packaging conference and exposition integration in Nuremberg, Germany, is still one month away but the Accumold marketing team is gearing up for its first-ever appearance at Europe’s leading event on microelectronics system integration.
The firm’s Vice-president of marketing and customer strategy Aaron Johnson said: “We normally try to add a conference and exposition or two to our itinerary each year. While this event is a new one for us, system integration in microelectronics is very familiar territory for everyone at Accumold.
“It turns out that the timing is terrific for our marketing team and it’s another one of those great opportunities to share the story of Accumold’s unique capabilities and create some new, mutually beneficial relationships.”
SMT Hybrid Packaging opens its three-day run on 5 June. The event’s sponsor Messe Frankfurt Group says that it is one of the only events in Europe that takes a comprehensive view of system integration in microelectronics, from the initial idea and its development right through to the production of all technical processes during the manufacture of electronic assemblies.
Johnson noted he is also looking forward to his role as a conference speaker. He will be delivering his presentation, ‘The Five Essentials of Micro Molding’, on the conference’s first morning.
Since its inception in 1985, Accumold’s mission has been to produce super-micro, ultra-precision, plastic injection-moulded parts.
Parts manufactured by the firm are critical components of the medical, automotive, military, aerospace and telecommunications industries. They can be found in micro-electronics, cell phones, telecommunications, surgical tools, hearing aids, medical devices, antennas, connectors and more.
To produce those parts, Accumold builds specialised moulding machines engineered to handle volumes from prototypes to millions per year while maintaining consistent, precise tolerances that are unique in the industry.